芯原微电子(上海)股份有限公司新闻资讯

• 基于公司芯片设计团队为客户设计的芯片开发包含设备驱动程序、中间件、参考应用的SDK;
• 开发跨平台的（ARM，RISC-V等）的统一化、模块化的嵌入式系统级芯片的 SDK;
• 提供整体芯片及板级的软件解决方案，支持客户基于SDK的二次开发以及产品生产；
• 可能从事的领域包括设备驱动程序、计算机视觉、GPU、多媒体、GUI、安全技术、图像信号处理、无线协议、传感器及相关算法等；

职位要求：

满足两种或以上条件者优先考虑：

1. 计算机、通信工程、信息工程、电子工程、自动化等相关专业优先;
2. 熟悉或精通一门编程语言,具体语言不限,熟悉C/C++/汇编更好;
3. 熟练掌握数据结构；
4. 理解一种或者一种以上操作系统，有过实际项目开发经验的优先；
5. 有一种嵌入式处理器体系架构开发经验 ARM， DSP ， RISC-V等嵌入式芯片；
6. 熟悉计算机图形学或者GPU(图形处理器)并有一定开发经验；
7. 熟悉DSP(数字信号处理器)，熟悉Matlab,并有实际项目的开发经验；
8. 熟悉Caffe、TensorFlow、Pytorch等机器学习框架并有算法训练基础;
9. 热爱核心技术开发、对技术工作充满热情、责任心强，有良好的团队合作精神；
10. 良好的英语和沟通能力,或者精通其它一门外语；
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Software Engineer:

Responsibilities:

You will be in a position responsible for one or more of below assignments:

• Develop SDK including device drivers, middleware, and reference application on top of the chip designed by chip design team;
• Develop unified, modular SDK (software development kit) platform across multiple CPU architecture (ARM, RISC-V etc.);
• Provide total/turnkey software solution on top of SoC(system on chip), support the software development of customers and help customers with problem solving and mass production;
• Automation testing for Linux/Android/Chromium OS;
• Join the development of one the following domains including but not limited to Linux/RTOS device drivers, computer vision, graphics, multimedia framework, GUI, security, ISP(image signal processing), BT/Wifi software stack, sensors and relevant algorithms, Android/Linux/Chromium SDK etc.;

Job Requirement：

Candidates meet two or above two criteria are preferred：

1. Major in computer science, communication engineering, information technologies, electronic engineering etc.;
2. Experienced with programming at least with one programming language, C/C++ or assembly is even better;
3. Familiar with data structure or compiler;